2026 International Conference on Innovation Design and Digital Manufacturing (IDDM 2026)
Join us in Hangzhou, China, Feb 28-March 1, 2026 for a gathering of global leaders in design and manufacturing innovation.
About IDDM 2026
We are excited to announce the 2026 International Conference on Innovation Design and Digital Manufacturing (IDDM 2026), a premier forum that brings together researchers, industry professionals, and thought leaders in the fields of innovation design and digital manufacturing. Set to take place in Hangzhou, China, IDDM 2026 offers a unique opportunity to share cutting-edge research, practical applications, and visionary insights that are driving the next wave of advancements in digital manufacturing and design.
As digital transformation reshapes the manufacturing landscape, IDDM 2026 invites contributions that address the challenges and opportunities posed by new technologies, from AI-driven design tools to additive manufacturing and smart factory solutions. This conference aims to foster interdisciplinary collaboration and explore how innovative design and advanced manufacturing techniques can fuel efficiency, sustainability, and economic growth. The IDDM 2026 is sponsored by Zhejiang Sci-Tech University, technical co-sponsored by IEEE RAS (Technical Committee on Digital Manufacturing and Human-Centered Automation)
Authors are required to submit their papers in a format that removes all identifying information, including author names, affiliations, and any other information that may reveal their identity in the body of the paper. Each paper will be evaluated by at least three expert reviewers who will assess the work based on its originality, technical quality, clarity of presentation, significance to the field, and relevance to the conference themes. Following the review process, papers will be accepted, recommended for revision, or rejected based on reviewers’ feedback and the consensus of the program committee.
Call for Papers
IDDM 2026 invites original research papers, case studies, and practical insights across various areas of design and manufacturing. Topics include, but are not limited to:
Advanced Manufacturing Processes
Human-Centered Design and Ergonomics
Automation and Robotics in Manufacturing
Digital Twin and Simulation
AI and Machine Learning in Manufacturing
Sustainable Manufacturing
Supply Chain and Operations Optimization
Cybersecurity in Manufacturing
Data Analytics and Big Data
Emerging Technologies and Applications
All papers accepted through the peer-review process will be published in the IDDM 2026 Conference Proceedings. Please use the paper template and online submission system to submit your papers (pdf only for review) (or send through email: iddmconf@163.com if your file (pdf) are larger than 10M).
Important Dates
Paper Submission Deadline: October 20, 2025
Notification of Acceptance: November 20, 2025
Final Paper Submission: December 20, 2025
Conference Dates: February 28-March 1, 2026
Venue - Hangzhou, China
Nestled in the heart of eastern China, Hangzhou is one of the country’s most historic and picturesque cities, often referred to as "Heaven on Earth" for its breathtaking landscapes and rich cultural heritage. As the capital of Zhejiang Province, Hangzhou is known for its unique blend of ancient charm and modern vitality, offering visitors a taste of traditional Chinese culture alongside a booming tech industry.
At the center of Hangzhou lies the famous West Lake, a UNESCO World Heritage site celebrated for its tranquil beauty, lush gardens, temples, and pagodas that have inspired poets and artists for centuries. Visitors can explore scenic spots like Lingyin Temple, one of China’s oldest and most revered Buddhist temples, or the serene Longjing Tea fields, where Hangzhou’s renowned Dragon Well green tea is cultivated.
Beyond its natural beauty, Hangzhou has established itself as a thriving hub for technology and innovation. It is the birthplace of Alibaba Group, and the city has emerged as a key player in China’s "Digital Silk Road." Hangzhou is also at the forefront of China’s smart city initiatives, with innovations in artificial intelligence, automation, and sustainable development transforming its urban landscape.
Combining a legacy of elegance and innovation, Hangzhou offers a vibrant environment for cultural exploration and modern business, making it an exceptional destination for international visitors and conferences.
Location: International Conference Center, Zhejiang Sci-Tech University, Xiasha, China
Registration
Normal Registration (6-10 pages): 500 USD
Student (6-10 pages): 400 USD
IEEE Membership (6-10 pages): 400 USD
Extra Page (more than 10 pages): 60 USD per page
Non-author: 150 USD
We will provide the registration form after your paper is accepted.
Committees
International Advisory Board
Bogdan M. Wilamowski, Auburn University, USA
Lakhmi C. Jain, KES International, UK
Valentina E. Balas, Aurel Vlaicu University of Arad, Romania
Conference Chairs
Guoquan Huang, The Hong Kong Polytechnic University, China
Ting Hang, Shanghai Jiao Tong University, China
Program Committee Chairs
Qun Wu, Zhejiang Sci-Tech University, China
Pai Zheng, The Hong Kong Polytechnic University, China
Fuqian Shi, Rutgers University – New Brunswick, USA
International Program Committee (alphabetically)
Anca Ralescu, College of Engineering, University of Cincinnati, USA
Bernadette Bouchon-Meunier, UPMC - LIP6, Paris, France
Cornel Barna, Aurel Vlaicu University of Arad, Romania
Dan Ralescu, College of Engineering, University of Cincinnati, USA
Diego Andina, Univ. Politécnica de Madrid, Madrid SPAIN
Dragan Radojevic, Mihajlo Pupin Institute, Belgrade, Serbia
Eiji Uchino, Yamaguchi University, Japan
Emil M. Petriu, University of Ottawa, Canada
Fangyu Li, Southwest Jiaotong University, China
Flavius Petcut, Aurel Vlaicu University of Arad, Romania
Genoveffa Tortora, University of Salerno, Italy
Hacène Habbi, University Boumerdès, Algeria
Hani Hagras, University of Essex, UK
Herchang Ay, National Kaohsiung University, China
Hideyuki Takagi, Kyushu University, Japan
Imre J. Rudas, Óbuda University Budapest, Hungary
Jair Minoro Abe, Paulista University, Sao Paulo, Brazil
Janmenjoy Nayak, Maharaja Sriram Chandra Bhanja Deo (MSCB) University, India
Jasmko Tochiny, University Malaysia Sabah, Malaysia
Juanfang Xu, Jiangnan University, China
Jude Hemanth, Karunya University, India
K. SRUJAN RAJU, CMR Technical Campus, India
Kazumi Nakamatsu, University of Hyogo, Japan
Kelly Robinson, Electrostatic Answers LLC, USA
Kejun Zhang, Zhejiang University, China
Laszlo T. Koczy, Szechenyi Istvan University, Gyor, Hungary
Levente Kovacs, Obuda University, Budapest, Hungary
Lefteris Gortzis, University of Patras, Greece
Luis Gomez, Universidade Nova de Lisboa, Portugal
Marius M. Balas, Aurel Vlaicu University of Arad, Romania
Mehdi Roopaei, University of Wisconsin-Platteville, USA
Mihaela Luca, Romanian Academy, Iasi Branch, Romania
Milan Simic, RMIT University, Australia
Mojtaba Agha-Mirsalim, Amirkabir University of Technology, Iran